COMPOSITION, RESIN COMPOSITION, FILM FORMATION COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND
This composition comprises a compound (A) represented by formula (1) below and a compound (B) represented by formula (2) below. (The definitions of the elements in formula (1) are indicated in the description.) (In formula (2), the elements X, L1, Y, Ra, Rb, Rc, A, Z, p, m, n, and r are the same as...
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Main Authors | , , , , , , , , , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
04.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | This composition comprises a compound (A) represented by formula (1) below and a compound (B) represented by formula (2) below. (The definitions of the elements in formula (1) are indicated in the description.) (In formula (2), the elements X, L1, Y, Ra, Rb, Rc, A, Z, p, m, n, and r are the same as those in formula (1), and k represents an integer from 0 to 2.)
Cette composition comprend un composé (A) représenté par la formule (1) ci-jointe et un composé (B) représenté par la formule (2) ci-jointe. (Les définitions des éléments dans la formule (1) sont indiquées dans la description.) (Dans la formule (2), les éléments X, L1, Y, Ra, Rb, Rc, A, Z, p, m, n et r sont les mêmes que ceux dans la formule (1), et k représente un nombre entier compris entre 0 et 2.)
下記式(1)で表される化合物(A)と、下記式(2)で表される化合物(B)とを含む組成物。 (式(1)中、各定義については明細書中に示す。) (式(2)中、 X、L1、Y、Ra、Rb、Rc、A、Z、p、m、n、及びrは式(1)の記載と同じ内容であって、kは0以上2以下の整数を表す。) |
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Bibliography: | Application Number: WO2023JP23917 |