HEIGHT COMPENSATION METHOD FOR PRINTING PLATFORM, APPARATUS, AND COMPUTER DEVICE

• Main Authors: WANG, Yulong, TANG, Jingke
• Format: Patent
• Language: Chinese; English; French
• Published: 04.01.2024
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A height compensation method for a printing platform, an apparatus, and a computer device. The method comprises: determining a measurement point to be compensated in a printing platform, and a plurality of neighboring areas located at the neighboring position of said measurement point in the printing platform, each neighboring area comprising at least two adjacent measurement points; projecting the at least two adjacent measurement points in each neighboring area to a preset first projection plane to obtain at least two first projection points, and performing linear fitting processing on the at least two first projection points to obtain a first fitting line corresponding to each neighboring area; according to the first fitting line corresponding to each neighboring area, respectively determining each compensation reference point; and projecting each compensation reference point to a preset second projection plane to obtain each second projection point, and according to each second projection point, performin