RESIN COMPOSITION, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

• Main Authors: KUZUOKA, Hiroki, KOTAKE, Tomohiko
• Format: Patent
• Language: English; French; Japanese
• Published: 12.01.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

A resin composition comprising (A) a heat-curable resin, (B) a compound which is liquid at 25°C and has a reactive group and a molecular weight of 1,000 or less, and (C) an inorganic filler; a resin film obtained from the resin composition; a printed wiring board; and a semiconductor package. L'invention concerne une composition de résine comprenant (A) une résine thermodurcissable, (B) un composé qui est liquide à 25 °C et a un groupe réactif et un poids moléculaire de 1000 ou moins, et (C) une charge inorganique ; un film de résine obtenu à partir de la composition de résine ; une carte de circuit imprimé ; et un boîtier de semi-conducteur. （Ａ）熱硬化性樹脂と、（Ｂ）２５℃で液体状であって、反応性基を有し、分子量が１，０００以下である化合物と、（Ｃ）無機充填材と、を含有する、樹脂組成物、該樹脂組成物を用いた樹脂フィルム、プリント配線板及び半導体パッケージである。