SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLICED IN A WIRE SAW

Systems and methods for controlling the surface profiles of wafers sliced in a wire saw machine. The systems and methods are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered for example by changing...

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Bibliographic Details
Main Authors LUTER, William L, BHAGAVAT, Sumeet S, ZAVATTARI, Carlo, ALBRECHT, Peter D
Format Patent
LanguageEnglish
French
Published 14.12.2023
Subjects
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:Systems and methods for controlling the surface profiles of wafers sliced in a wire saw machine. The systems and methods are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered for example by changing the temperature of a temperature-controlling fluid circulated in fluid communication with side walls attached to a fixed bearing sidewall of the wire saw. L'invention concerne des systèmes et des procédés de régulation des profils de surface de plaquettes tranchées dans une machine à scier à fil. Les systèmes et procédés servent généralement à modifier la nanotopologie de plaquettes tranchées dans un lingot en régulant la forme des plaquettes. La forme des plaquettes est modifiée par exemple en changeant la température d'un fluide de régulation de température mis en circulation en communication fluidique avec des parois latérales fixées à une paroi latérale de support fixe de la scie à fil.
Bibliography:Application Number: WO2023US24219