METAL STRUCTURAL MEMBER USED IN COOPERATION WITH GALLIUM-BASED LIQUID METAL, MANUFACTURING METHOD THEREFOR, AND APPLICATION THEREOF

• Main Authors: TANG, Huifang, CAI, Changli, YANG, Yingbao, CHEN, Daotong, GENG, Chengdu, ZHANG, Ji, AN, Jianping, DU, Wangli
• Format: Patent
• Language: Chinese; English; French
• Published: 16.11.2023
• Subjects: ALLOYS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF ALLOYS OR NON-FERROUS METALS

Disclosed in the present invention is a metal structural member used in cooperation with gallium-based liquid metal. A high-phosphorus nickel alloy layer is provided on the surface of the metal structural member in contact with the gallium-based liquid metal. When the metal structural member is in contact with the gallium-based liquid metal, the metal structural member does not react with the gallium-based liquid metal, such that reduction of the heat dissipation performance caused by consumption of the gallium-based liquid metal is avoided. Further disclosed in the present invention are a manufacturing method for the metal structural member, and an application of the metal structural member in heat dissipation of computer chips, mobile phone chips, communication products, high-power LEDs, insulated gate bipolar transistors, and high-power electronic products. La présente invention concerne un élément structural métallique utilisé en coopération avec un métal liquide à base de gallium. Une couche d'alliage de