CARRIER FOR DOUBLE-SIDED POLISHING, AND SILICON WAFER DOUBLE-SIDED POLISHING METHOD AND DEVICE EMPLOYING SAME

• Main Authors: TAKUBO Shinya, MIKURIYA Shunsuke
• Format: Patent
• Language: English; French; Japanese
• Published: 26.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

[Problem] To provide a carrier for double-sided polishing, with which an increase in service life can be achieved by improving wear resistance, and a silicon wafer double-sided polishing method and device employing the same. [Solution] A carrier 10 for double-sided polishing according to the present...