RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND DISPLAY DEVICE

• Main Authors: SHOJI Yu, SAKAI Tomoki, AOSHIMA Kenta, ASANO Itaru, ICHINOSE Keiko, ARAKI Hitoshi
• Format: Patent
• Language: English; French; Japanese
• Published: 28.09.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A resin composition containing (A) a soluble resin, (B) an organic salt, and (C) a solvent, wherein the (B) organic salt is formed from a carboxy-group-containing organic compound and an amino-group-containing organic compound, and the (B) organic salt is 0.01-10 parts by mass per 100 parts by mass of the (A) soluble resin.　Provided is a resin composition having exceptional substrate adhesion and exceptional storage stability. L'invention concerne une composition de résine contenant (A) une résine soluble, (B) un sel organique, et (C) un solvant, le sel organique (B) étant formé à partir d'un composé organique contenant un groupe carboxy et d'un composé organique contenant un groupe amino, et le sel organique (B) étant de 0,01 à 10 parties en masse pour 100 parties en masse de la résine soluble (A).　L'invention concerne une composition de résine ayant une adhérence de substrat exceptionnelle et une stabilité au stockage exceptionnelle. （Ａ）可溶性樹脂、（Ｂ）有機塩および（Ｃ）溶剤を含有する樹脂組成物であって、前記（Ｂ）有機塩がカルボキシ基を有する有機化合物と、アミノ基を有する有機化合物から形成される有機塩であって、前記（Ａ）可溶性樹脂１００質量部に対して、前記（Ｂ）有機塩が０．０１～１０質量部である樹脂組成物。　基板密着性に優れ、かつ保存安定性に優れる樹脂組成物を提供する。