ELECTRONIC DEVICE COMPRISING BRIDGE PRINTED CIRCUIT BOARD

• Main Authors: LEE, Hyeongju, PARK, Jinyong, YUN, Hyelim, KIM, Taewoo, MIN, Bongkyu
• Format: Patent
• Language: English; French; Korean
• Published: 14.09.2023
• Subjects: ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TELEPHONIC COMMUNICATION

According to various embodiments, an electronic device may comprise: a first printed circuit board including a main hole; a second printed circuit board inserted into the main hole and encompassed by the first printed circuit board; a bridge printed circuit board, which connects the first printed circuit board and the second printed circuit board, is overlapped with each of the first printed circuit board and the second printed circuit board and includes a bridge hole; an application processor disposed on the second printed circuit board, inserted into the bridge hole and encompassed by the bridge printed circuit board; and a main shield, which is connected to the bridge printed circuit board and covers the application processor. Other various embodiments are possible. Selon divers modes de réalisation, un dispositif électronique peut comprendre : une première carte de circuit imprimé comprenant un trou principal ; une seconde carte de circuit imprimé insérée dans le trou principal et enveloppée par la première carte de circuit imprimé ; une carte de circuit imprimé en pont, qui relie la première carte de circuit imprimé et la seconde carte de circuit imprimé, est superposée à la première carte de circuit imprimé et à la seconde carte de circuit imprimé et comprend un trou en pont ; un processeur d'application disposé sur la seconde carte de circuit imprimé, inséré dans le trou en pont et enveloppé par la carte de circuit imprimé en pont ; et un blindage principal, qui est connecté à la carte de circuit imprimé en pont et recouvre le processeur d'application. Divers autres modes de réalisation sont possibles. 다양한 실시 예들에 따르면, 전자 장치는, 메인 홀을 포함하는 제 1 인쇄회로기판과, 상기 메인 홀에 삽입되고, 상기 제 1 인쇄회로기판에 의해 둘러싸인 상태로 마련되는 제 2 인쇄회로기판과, 상기 제 1 인쇄회로기판 및 제 2 인쇄회로기판을 연결하고, 상기 제 1 인쇄회로기판 및 제 2 인쇄회로기판 각각에 오버랩되고, 브릿지 홀을 포함하는 브릿지 인쇄회로기판과, 상기 제 2 인쇄회로기판에 배치되고, 상기 브릿지 홀에 삽입되고, 상기 브릿지 인쇄회로기판에 의해 둘러싸인 상태로 마련되는 어플리케이션 프로세서와, 상기 브릿지 인쇄회로기판에 연결되고, 상기 어플리케이션 프로세서를 커버하는 메인 쉴드를 포함할 수 있다. 그 외에도 다양한 실시 예들이 가능하다.