CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR

• Main Authors: TOMISAKA Katsuhiko, SEKI Hideyuki, MATSUZAKI Toshiaki, YAMAZAKI Shohei, MATSUZAWA Mitsuharu
• Format: Patent
• Language: English; French; Japanese
• Published: 14.09.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

Conductive particles P which have an individual dispersion ratio of at least 90.0% and are used to produce an adhesive film for circuit connection, said conductive particles P each comprising a conductive parent particle 31 and child particles 32 covering the surface of the parent particle 31, wherein the ratio of the average particle size of the child particles 32 in ethyl acetate to the average particle size of the child particles 32 in water is at most 1.20. Particules conductrices (P) qui présentent un rapport de dispersion individuel d'au moins 90,0 % et sont utilisées pour produire un film adhésif pour une connexion de circuit, lesdites particules conductrices P comprenant chacune une particule parent conductrice (31) et des particules enfants (32) recouvrant la surface de la particule parent (31), le rapport entre la taille de particule moyenne des particules enfants (32) dans de l'acétate d'éthyle et la taille de particule moyenne des particules enfants (32) dans l'eau étant d'au plus 1,20. 単分散率が９０．０％以上である回路接続用接着フィルムの製造に用いられる導電粒子であって、導電性の母粒子３１と、該母粒子３１の表面を被覆する子粒子３２と、を備え、該子粒子３２の、水中での平均粒子径に対する酢酸エチル中での平均粒子径の比が、１．２０以下である、導電粒子Ｐ。