CIRCUIT SUBSTRATE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

A circuit substrate (1) is provided with an electronic component (100), and a printed wiring board (20) on which the electronic component (100) is mounted by soldering. The electronic component (100) comprises a pad electrode (120) disposed on a bottom portion of a body portion (110). The pad electr...

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Bibliographic Details
Main Authors MOTOFUSA, Toshiharu, YAMANAKA, Shohei
Format Patent
LanguageEnglish
French
Japanese
Published 31.08.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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