APPARATUS AND METHOD FOR CUTTING A SUBSTRATE

The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds and their cutting edges...

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Bibliographic Details
Main Authors BUSCH, James, BITTNER, Dale
Format Patent
LanguageEnglish
French
Published 03.08.2023
Subjects
CUTTING
DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING
HAND CUTTING TOOLS
PERFORMING OPERATIONS
SEVERING
TRANSPORTING
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Summary:The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds and their cutting edges define a cutting circumference which is immediately adjacent or intersects with, a surface of an anvil. La présente invention concerne un appareil et un procédé permettant de couper un substrat, l'appareil comprenant des premier et second éléments de coupe et, les premier et second éléments de coupe pouvant tourner autour de l'axe de rotation à différentes vitesses circonférentielles et leurs bords de coupe définissant une circonférence de coupe qui est immédiatement adjacente ou croise une surface d'une enclume.
Bibliography:Application Number: WO2023US60866