PLASMA TREATMENT DEVICE FOR POWDER

• Main Authors: LEE, Deuk Yeon, LEE, Chang Young, LEE, Ja Eun, HAN, Yeon Bi
• Format: Patent
• Language: English; French; Korean
• Published: 20.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention provides a plasma treatment device for plasma-treating powder in a plasma reactor in which electrodes are installed, the plasma treatment device for powder comprising: a chamber having an inner space in which powder is supplied, and supplying a blowing gas to the supplied powder to mix the powder while flowing same in the inner space; a plasma reactor which is disposed in the chamber, generates plasma to treat the surface of the powder, is disposed apart from the supplied powder, and has a porous structure having a nano or micro size; a power supply device which applies DC power or AC power to the plasma reactor; and a pumping and counter-current means that adsorbs or separates the powder on the surface of the plasma reactor by varying the pressure of the plasma reactor or the inner space of the chamber. Therefore, by using direct current or alternating current as a plasma generating power source for surface-treatment of powder, there is an advantage in achieving reproducible and effective surface treatment efficiency while reducing equipment cost and volume. La présente invention concerne un dispositif de traitement au plasma permettant de traiter une poudre au plasma dans un réacteur à plasma dans lequel sont installées des électrodes, le dispositif de traitement au plasma pour poudre comprenant : une chambre comportant un espace interne dans lequel de la poudre est introduite, et fournissant un gaz de soufflage à la poudre introduite afin de mélanger la poudre tout en la faisant s'écouler dans l'espace interne ; un réacteur à plasma qui est disposé dans la chambre, qui génère un plasma afin de traiter la surface de la poudre, qui est disposé à distance de la poudre introduite, et qui présente une structure poreuse possédant une taille nanométrique ou micrométrique ; un dispositif d'alimentation électrique qui applique un courant continu ou un courant alternatif au réacteur à plasma ; et un moyen de pompage et de contre-courant qui adsorbe ou sépare la poudre sur la surface du réacteur à plasma en faisant varier la pression du réacteur à plasma ou de l'espace interne de la chambre. Ainsi, à l'aide d'un courant continu ou d'un courant alternatif en tant que source d'énergie de génération de plasma en vue du traitement de surface d'une poudre, une efficacité de traitement de surface reproductible et efficace est avantageusement obtenue, tout en réduisant le coût et le volume d'équipement. 본 발명은 분말을 전극이 설치된 플라즈마 반응기를 통해 플라즈마 처리하는 플라즈마 처리장치에 있어서, 분말이 공급되는 내부 공간을 가지며, 상기 공급된 분말에 블로윙 가스를 공급하여 상기 분말을 상기 내부 공간 내에서 유동시키면서 혼합시키는 챔버, 상기 챔버 내에 배치되며, 플라즈마를 생성하여 상기 분말을 표면처리하며, 상기 공급된 분말과는 이격되어 배치되고, 나노 또는 마이크로 사이즈를 포함하는 다공성 구조를 가지는 플라즈마 반응기, 상기 플라즈마 반응기에 직류 전원 또는 교류 전원을 인가하는 전원 장치 및 상기 플라즈마 반응기 또는 상기 챔버의 내부 공간의 압력을 변동시켜서, 상기 플라즈마 반응기의 표면에 상기 분말을 흡착시키거나 분리하는 펌핑 및 역류수단을 포함하는, 분말용 플라즈마 처리장치를 제공한다. 따라서 분말의 표면처리를 위한 플라즈마 발생 전원으로 직류 또는 교류를 사용함으로써 장비 가격과 부피를 줄이면서도 재현성 있고 유효한 표면 처리효율을 달성할 수 있는 장점이 있다.