PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: UENO, Yoshikazu, UEHARA, Yosuke
• Format: Patent
• Language: English; French; Japanese
• Published: 06.07.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTROGRAPHY; HOLOGRAPHY; LINING MACHINES; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM; PRINTING; PRINTING PLATES OR FOILS; STAMPS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TYPEWRITERS

This photosensitive resin composition comprises a thermoplastic elastomer (A), a liquid farnesene rubber (B), an ethylenic unsaturated compound (C), and a photoinitiator (D). Cette composition de résine photosensible comprend un élastomère thermoplastique (A), un caoutchouc de farnésène liquide (B), un composé insaturé éthylénique (C) et un photoinitiateur (D). 熱可塑性エラストマー（Ａ）、液状ファルネセン系ゴム（Ｂ）、エチレン性不飽和化合物（Ｃ）、及び光開始剤（Ｄ）を含む感光性樹脂組成物。