HEAT DISSIPATION MATERIAL, COMPOSITION INCLUDING SAME, AND PREPARATION METHOD THEREFOR

• Main Authors: KIM, Yun Jin, LEE, Seung Hyup, CHO, Su Hyeon, YUN, Gyeong Ho, NAM, Min Ho
• Format: Patent
• Language: English; French; Korean
• Published: 29.06.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is a heat dissipation material. The heat dissipation material has a charging filler including secondary particles agglomerated from primary particles, wherein the charging filler in a polymer resin matrix may form a thermal interface layer for the conduction of heat between a heat generation portion and a heat absorption portion. La présente invention concerne un matériau de dissipation de chaleur. Le matériau de dissipation de chaleur présente un matériau de remplissage de charge comprenant des particules secondaires agglomérées à partir de particules primaires, le matériau de remplissage de charge dans une matrice de résine polymère pouvant former une couche d'interface thermique pour la conduction de chaleur entre une portion de génération de chaleur et une portion d'absorption de chaleur. 방열 소재가 제공된다. 1차 입자가 응집된 2차 입자를 포함하는 충전 필러를 갖는 상기 방열 소재에 있어서, 고분자 수지 매트릭스 내의 상기 충전 필러는, 열 발생부 및 열 흡수부 사이의 열 전도를 위한 열 계면층을 형성할 수 있다.