DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT EMITTING ELEMENT

A display device according to an embodiment comprises: a substrate; a first assembly wiring and a second assembly wiring spaced apart from each other on the substrate; a first insulating layer disposed between the first assembly wiring and the second assembly wiring; a first planarization layer whic...

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Bibliographic Details
Main Authors KIM, Minseok, JANG, Hun, EOM, Hyeseon, NAM, Juhyun, KIM, Youngdo
Format Patent
LanguageEnglish
French
Korean
Published 15.06.2023
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Summary:A display device according to an embodiment comprises: a substrate; a first assembly wiring and a second assembly wiring spaced apart from each other on the substrate; a first insulating layer disposed between the first assembly wiring and the second assembly wiring; a first planarization layer which is disposed on the second assembly wiring and has an opening portion which overlaps the second assembly wiring; a light emitting element which is disposed inside the opening portion and comprises a first semiconductor layer and a second semiconductor layer on the first semiconductor layer; and a contact electrode which electrically connects the second assembly wiring and the first semiconductor layer, wherein the contact electrode is in contact with a side surface of the first semiconductor layer and the second assembly wiring which overlaps the first planarization layer. Un mode de réalisation de la présente invention concerne un dispositif d'affichage qui comprend : un substrat ; un premier câblage d'assemblage et un second câblage d'assemblage espacés l'un de l'autre sur le substrat ; une première couche isolante disposée entre le premier câblage d'assemblage et le second câblage d'assemblage ; une première couche de planarisation qui est disposée sur le second câblage d'assemblage et a une partie d'ouverture qui chevauche le second câblage d'assemblage; un élément électroluminescent qui est disposé à l'intérieur de la partie d'ouverture et comprend une première couche semi-conductrice et une seconde couche semi-conductrice sur la première couche semi-conductrice ; et une électrode de contact qui connecte électriquement le second câblage d'assemblage et la première couche semi-conductrice, l'électrode de contact étant en contact avec une surface latérale de la première couche semi-conductrice et le second câblage d'assemblage qui chevauche la première couche de planarisation. 실시예에 따른 디스플레이 장치는, 기판, 기판 상에서 서로 이격된 제1 조립 배선 및 제2 조립 배선, 제1 조립 배선과 제2 조립 배선 사이에 배치된 제1 절연층, 제2 조립 배선 상에 배치되고, 제2 조립 배선과 중첩하는 개구부를 갖는 제1 평탄화층, 개구부 내측에 배치되고, 제1 반도체층 및 제1 반도체층 상의 제2 반도체층을 포함하는 발광 소자, 및 제2 조립 배선과 제1 반도체층을 전기적으로 연결하는 컨택 전극을 포함하고, 컨택 전극은 제1 반도체층의 측면, 제1 평탄화층과 중첩하는 제2 조립 배선에 접한다.
Bibliography:Application Number: WO2022KR18939