METHOD FOR FORMING CIRCUIT PATTERN ON SUBSTRATE BY USING METAL FOIL WITH LOW SURFACE ROUGHNESS

• Main Authors: KIM, Dea Geun, AN, Jae Hak, CHUNG, Bo Mook, KANG, Hyun Seung, CHUN, Sung Wook, PARK, Myong Whan, YANG, Dongmin
• Format: Patent
• Language: English; French; Korean
• Published: 01.06.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to a method for forming a circuit pattern on a substrate by using metal foil with low surface roughness and small thickness to form the circuit pattern on the substrate through a circuit pattern formation process such as a semi additive process (SAP) or modified semi additive process (mSAP). La présente invention concerne un procédé de formation d'un motif de circuit sur un substrat en utilisant une feuille métallique ayant une faible rugosité de surface et une faible épaisseur pour former le motif de circuit sur le substrat par l'intermédiaire d'un processus de formation de motif de circuit tel qu'un procédé semi-additif (SAP) ou un procédé semi-additif modifié (mSAP). 본 발명은 세미 에디티브법(Semi additive process, SAP), 또는 모디파이드 세미 에디티브법(Modified semi additive process, mSAP)과 같은 회로패턴 형성 공정을 통해 기판에 회로패턴을 형성함에 있어, 표면조도가 낮고 두께가 얇은 금속박을 이용하는 것을 특징으로 하는 기판의 회로패턴 형성방법에 관한 것이다.