ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT BONDING PERFORMANCE AND RELIABILITY AND PREPARATION METHOD THEREFOR

• Main Authors: CHEN, Tianan, XIE, Haihua, WANG, Jianbin, JIANG, Yun, XU, Youzhi
• Format: Patent
• Language: Chinese; English; French
• Published: 25.05.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

An organopolysiloxane composition having excellent bonding performance and reliability and a preparation method therefor, especially an organopolysiloxane composition suitable for positioning and bonding a heat dissipation cover plate of a semiconductor chip, and a preparation method therefor. Branched hydrogen-containing polysiloxane is used as a cross-linking agent, such that the reaction activity is improved while reinforcement is carried out; a self-made capsule type platinum catalyst is used, such that the occurrence of a reaction is well inhibited at a low temperature, rapid dissociation and release are implemented at a high temperature, and a rapid cross-linking reaction can be carried out; and meanwhile, by means of an effective pre-reaction treatment mode of a bonding promoter and Si-H bond-containing organopolysiloxane, excellent bonding performance and bonding reliability are provided, and an effective method for avoiding the generation of H2 in a long-term storage process is provided at the same t