HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE

• Main Authors: KAWAI Yoshio, TSUYUKI Yasuhiro, NAMBA Akihiro
• Format: Patent
• Language: English; French; Japanese
• Published: 27.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

In this insulating heat dissipation member that uses a spherical filler, at least 20% of the filler has particle sizes of 200 μm to 1,000 μm with respect to the total volume of the filler, and/or at least 20% of the filler has particle sizes of 1 nm to 10 μm. Dans un élément de dissipation de chaleur isolant qui utilise une charge sphérique, au moins 20 % de la charge présente des tailles de particules de 200 µm à 1 000 µm par rapport au volume total de la charge, et/ou au moins 20 % de la charge présente des tailles de particules de 1 nm à 10 µm. 球状のフィラを用いた絶縁性の放熱材において、前記フィラの全量に対し、粒径２００μｍ以上、１０００μｍ以下のフィラの割合が２０％以上、および粒径１ｎｍ以上、１０μｍ以下のフィラの割合が２０％以上の少なくとも一方である。