PREPARATION METHOD FOR SEMICONDUCTOR PACKAGING MATERIAL OR SUBSTRATE MATERIAL, AND SEMICONDUCTOR PACKAGING MATERIAL OR SUBSTRATE MATERIAL OBTAINED THEREBY AND APPLICATION THEREOF

• Main Authors: WANG, Ke, SHEN, Haibin, FANG, Yuanfeng, CHEN, Shuzhen
• Format: Patent
• Language: Chinese; English; French
• Published: 09.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention provides a preparation method for a semiconductor packaging material or a substrate material, comprising: providing spherical or amorphous polysiloxane; rising, in an oxidizing gas atmosphere before organic components in polysiloxane particles are completely oxidized, the tempe...