WAFER HANDLING APPARATUS AND METHOD

The present invention provides a wafer handling apparatus, comprising a first supporting mechanism and a second supporting mechanism outer sidewalls of which are both provided with pickup and delivery guide structures; a first pickup and delivery mechanism and a second pickup and delivery mechanism,...

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Bibliographic Details
Main Authors WU, Tian Yao, CHEN, Xing Long, MIAO, Tao, WANG, Hao
Format Patent
LanguageChinese
English
French
Published 02.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a wafer handling apparatus, comprising a first supporting mechanism and a second supporting mechanism outer sidewalls of which are both provided with pickup and delivery guide structures; a first pickup and delivery mechanism and a second pickup and delivery mechanism, which are movably provided on the pickup and delivery guide structure of the first supporting mechanism and the pickup and delivery guide structure of the second supporting mechanism, respectively, the first pickup and delivery mechanism and the second pickup and delivery mechanism both comprising end actuators opposite to each other; and a rotating mechanism and a rotation driving portion, the first supporting mechanism and the second supporting mechanism being fixedly provided on the rotating mechanism, and the rotating driving portion driving the rotating mechanism to rotate, such that at least one of the first supporting mechanism and the second supporting mechanism is driven to synchronously rotate, the picku
Bibliography:Application Number: WO2021CN120095