LEVELING AGENT, AND ELECTROPLATING COMPOSITION COMPRISING SAME FOR FILLING VIA HOLE

• Main Authors: KIM, Dea Geun, KO, Nak Eun, SIM, Ju Yong, CHUNG, Bo Mook, CHUN, Sung Wook
• Format: Patent
• Language: English; French; Korean
• Published: 02.02.2023
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The present invention relates to a leveling agent and an electroplating composition comprising same. When a via hole of a substrate is filled with the electroplating composition according to the present invention, the via hole can be filled relatively quickly while minimizing the formation of dimples or voids. La présente invention concerne un agent de nivellement et une composition d'électrodéposition le comprenant. Lorsqu'un trou d'interconnexion d'un substrat est rempli avec la composition d'électrodéposition selon la présente invention, le trou d'interconnexion peut être rempli relativement rapidement tout en réduisant au minimum la formation d'alvéoles ou de vides. 본 발명은 레벨링제 및 이를 포함하는 전기도금 조성물에 관한 것으로, 본 발명에 따른 전기도금 조성물로 기판의 비아홀을 충진할 경우, 딤플 또는 보이드가 형성되는 것을 최소화하면서 비교적 빠른 시간 내에 비아홀을 충진할 수 있다.