LEVELING AGENT AND ELECTROPLATING COMPOSITION COMPRISING SAME FOR FILLING VIA HOLE
The present invention relates to a leveling agent and an electroplating composition comprising same, wherein when a via hole in a substrate is filled with the electroplating composition according to the present invention, the via hole can be filled within a relatively short time, while minimizing fo...
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Main Authors | , , , , |
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Format | Patent |
Language | English French Korean |
Published |
02.02.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a leveling agent and an electroplating composition comprising same, wherein when a via hole in a substrate is filled with the electroplating composition according to the present invention, the via hole can be filled within a relatively short time, while minimizing formation of dimples or voids.
La présente invention concerne un agent de nivellement et une composition d'électrodéposition le comprenant, lorsqu'un trou d'interconnexion dans un substrat est rempli avec la composition d'électrodéposition selon la présente invention, le trou d'interconnexion peut être rempli en un temps relativement court, tout en réduisant au minimum la formation d'alvéoles ou de vides.
본 발명은 레벨링제 및 이를 포함하는 전기도금 조성물에 관한 것으로, 본 발명에 따른 전기도금 조성물로 기판의 비아홀을 충진할 경우, 딤플 또는 보이드가 형성되는 것을 최소화하면서 비교적 빠른 시간 내에 비아홀을 충진할 수 있다. |
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Bibliography: | Application Number: WO2022KR11217 |