3-DIMENSIONAL NEUROMORPHIC SYSTEM AND OPERATION METHOD THEREOF
The present invention relates to a technology for independently connecting and forming, through interconnection layers, a plurality of neuromorphic devices that are 3-dimensionally stacked and formed on a complementary metal-oxide semiconductor (CMOS) wafer, and selectively driving and testing the p...
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Main Authors | , , , |
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Format | Patent |
Language | English French Korean |
Published |
29.12.2022
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Subjects | |
Online Access | Get full text |
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