SHELL STRUCTURES FOR THERMAL INTERFACE MATERIALS

• Main Authors: GAIDE, Tom, TEGEDER, Patricia, EICHLER, Jens, OSTROWSKI, Karoline Anna, BRAND, Simon
• Format: Patent
• Language: English; French
• Published: 08.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention relates to a thermally conductive structure comprising a first and a second element, a shell structure between the first element and the second element, wherein the shell structure, the first element and the second element define an enclosed space, and a thermal interface material comprised in the enclosed space. La présente invention concerne une structure thermoconductrice comprenant un premier et un second élément, une structure d'enveloppe entre le premier élément et le second élément, la structure d'enveloppe, le premier élément et le second élément définissant un espace fermé, et un matériau d'interface thermique compris dans l'espace fermé.