METHOD TO IMPROVE WAFER EDGE UNIFORMITY

• Main Author: TONG, Mingle
• Format: Patent
• Language: English; French
• Published: 24.11.2022
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Exemplary semiconductor processing systems may include a chamber body having sidewalls and a base. The semiconductor processing systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate. The substrates support may include a shaft coupled with the support plate. The semiconductor processing systems may include a liner positioned within the chamber body and positioned radially outward of a peripheral edge of the support plate. An inner surface of the liner may include an emissivity texture. Des exemples de systèmes de traitement de semi-conducteurs selon la présente invention peuvent inclure un corps de chambre comprenant des parois latérales et une base. Les systèmes de traitement de semi-conducteurs peuvent inclure un support de substrat s'étendant à travers la base du corps de chambre. Le support de substrat peut inclure une plaque de support. Le support de substrat peut inclure un arbre couplé à la plaque de support. Les systèmes de traitement de semi-conducteurs peuvent inclure une garniture positionnée à l'intérieur du corps de chambre et positionnée radialement vers l'extérieur d'un bord périphérique de la plaque de support. Une surface interne de la garniture peut inclure une texture d'émissivité.