CMP COMPOSITIONS FOR POLISHING DIELECTRIC MATERIALS

Provided are improved slurry compositions useful in the CMP polishing of glass and other dielectric materials. In one aspect, the compositions of the invention are comprised of water; silica abrasive; a cationic surfactant; and ceria abrasive. The compositions effect a high removal rate while limiti...

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Bibliographic Details
Main Authors SINGH, Rajiv K, RAJOPADHYE, Akshay, DE, Sunny
Format Patent
LanguageEnglish
French
Published 20.10.2022
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
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Summary:Provided are improved slurry compositions useful in the CMP polishing of glass and other dielectric materials. In one aspect, the compositions of the invention are comprised of water; silica abrasive; a cationic surfactant; and ceria abrasive. The compositions effect a high removal rate while limiting the number of scratches typically observed when utilizing ceria alone. L'invention concerne des compositions améliorées de suspension épaisse utiles pour le polissage CMP du verre et d'autres matériaux diélectriques. Selon un aspect, les compositions de l'invention sont constituées d'eau ; d'un abrasif de type silice ; d'un tensioactif cationique ; et d'un abrasif de type oxyde de cérium. Les compositions permettent d'avoir une vitesse élevée d'enlèvement tout en limitant le nombre de rayures que l'on observe habituellement quand on utilise de l'oxyde de cérium seul.
Bibliography:Application Number: WO2022US24372