METHOD AND APPARATUS FOR PRODUCT-TO-PRODUCT ATTACHMENT

According to various embodiments, an outer covering of an electronic apparatus may comprise a cover part, and a coupling part provided on the rear surface of the cover part. The coupling part may comprise: a protruding part protruding above the rear surface of the cover part; an accommodation part p...

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Bibliographic Details
Main Authors HONG, Jaehyung, PARK, Jeongseok, RHEE, Youngho
Format Patent
LanguageEnglish
French
Korean
Published 29.09.2022
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Summary:According to various embodiments, an outer covering of an electronic apparatus may comprise a cover part, and a coupling part provided on the rear surface of the cover part. The coupling part may comprise: a protruding part protruding above the rear surface of the cover part; an accommodation part provided in the center of the protruding part; and one or more grooves provided on the accommodation part side of the inner wall of the protruding part. Selon divers modes de réalisation, un revêtement extérieur d'un appareil électronique peut comprendre une partie couvercle et une partie de couplage présente sur la surface arrière de la partie couvercle La partie de couplage peut comprendre : une partie en saillie faisant saillie au-dessus de la surface arrière de la partie couvercle ; une partie de réception présente au centre de la partie en saillie ; et une ou plusieurs rainures présentes sur le côté de la partie de réception de la paroi interne de la partie en saillie. 다양한 실시예에 따라서, 전자 장치의 외장 커버는, 커버부; 및 상기 커버부의 후면에 형성되는 체결부를 포함할 수 있다. 상기 체결부는, 상기 커버부의 상기 후면 보다 돌출되도록 형성되는 돌출부, 상기 돌출부의 중심에 형성되는 수용부, 및 상기 돌출부에서 상기 수용부 방향의 내벽에 형성되는 적어도 하나의 홈을 포함할 수 있다.
Bibliography:Application Number: WO2022KR03212