HEAT-SEALABLE RESIN COMPOSITION, HEAT SEAL MATERIAL, PACKAGING MATERIAL, LID MATERIAL, AND PACKAGING CONTAINER

• Main Authors: SAKUMA, Masami, NAKANO, Shigenori, NISHIJIMA, Koichi, TAKAOKA, Hiroki
• Format: Patent
• Language: English; French; Japanese
• Published: 22.09.2022
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; DYES; HANDLING THIN OR FILAMENTARY MATERIAL; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PACKAGES; PACKAGING ELEMENTS; PACKING; PAINTS; PERFORMING OPERATIONS; POLISHES; STORING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

A heat-sealable resin composition including an ethylene-vinyl ester copolymer (A) and a tackifying resin (B), in which the content of a constituent unit derived from the vinyl ester included in the ethylene-vinyl ester copolymer (A) with respect to the total constituent units of the copolymer consti...