BONDING SHEET

• Main Authors: KATO, Masatoshi, NITTA, Ayumi, KOSAKA, Naofumi
• Format: Patent
• Language: English; French; Japanese
• Published: 15.09.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; ALLOYS; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CURRENT COLLECTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DYES; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; LINE CONNECTORS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; SOLDERING OR UNSOLDERING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; WELDING; WORKING BY LASER BEAM

A bonding sheet according to the present invention contains a matrix resin, solder particles and a flux agent. This bonding sheet has a surface that has a surface roughness Sa of 2.5 μm or less. Une feuille de liaison selon la présente invention contient une résine de matrice, des particules de soudure et un agent de flux. Cette feuille de liaison a une surface qui présente une rugosité de surface Sa inférieure ou égale à 2,5 µm. 本発明の接合シートは、マトリックス樹脂と、ハンダ粒子と、フラックス剤とを含有する。接合シートは、表面粗さＳａが２．５μｍ以下の表面を有する。