LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING DEVICE HAVING SAME

• Main Authors: PARK, Moo Ryong, CHOI, Young Jae
• Format: Patent
• Language: English; French; Korean
• Published: 01.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; SEMICONDUCTOR DEVICES; WEAPONS

A lighting device disclosed in an embodiment of the invention may comprise: a light-emitting element package including a plurality of lead frames, a body to which the plurality of lead frames are coupled, a cavity in which a front surface portion of the body is open, and a light-emitting chip disposed in a first lead frame which is one of the plurality of lead frames; a circuit board on which the light-emitting element package is disposed and which has a first pad portion; a resin layer for covering the light-emitting element package on the circuit board; a reflective member which is disposed between the resin layer and the circuit board and in which a lower portion of the light-emitting element package is inserted; and a light-shielding portion vertically overlapping the light-emitting element package on the resin layer, wherein the first lead frame includes a first frame disposed on the bottom of the cavity, and a first bonding portion bent from the first frame toward a lower surface of the body and bonded to the first pad portion of the circuit board, and the first bonding portion protrudes from the lower surface of the body toward a rear surface portion of the body further than the rear surface portion of the body. Un dispositif d'éclairage décrit dans un mode de réalisation de l'invention peut comprendre : un boîtier d'élément électroluminescent comprenant une pluralité de grilles de connexion, un corps auquel la pluralité de grilles de connexion sont couplées, une cavité dans laquelle une partie de surface avant du corps est ouverte, et une puce électroluminescente disposée dans une première grille de connexion qui est l'une de la pluralité de grilles de connexion ; une carte de circuit imprimé sur laquelle est disposé le boîtier d'élément électroluminescent et qui a une première partie de plot ; une couche de résine pour recouvrir le boîtier d'élément électroluminescent sur la carte de circuit imprimé ; un élément réfléchissant qui est disposé entre la couche de résine et la carte de circuit imprimé et dans lequel une partie inférieure du boîtier d'élément électroluminescent est insérée ; et une partie de protection contre la lumière chevauchant verticalement le boîtier d'élément électroluminescent sur la couche de résine. La première grille de connexion comprend un premier cadre disposé sur le fond de la cavité, et une première partie de liaison pliée à partir du premier cadre vers une surface inférieure du corps et liée à la première partie de plot de la carte de circuit imprimé, et la première partie de liaison fait saillie à partir de la surface inférieure du corps vers une partie de surface arrière du corps plus loin que la partie de surface arrière du corps. 발명의 실시 예에 개시된 조명 장치는 복수의 리드 프레임, 상기 복수의 리드 프레임이 결합된 몸체, 및 상기 몸체의 전면부가 개방된 캐비티, 및 상기 복수의 리드 프레임 중 어느 하나인 제1리드 프레임에 배치된 발광 칩을 포함하는 발광소자 패키지; 상기 발광소자 패키지가 배치되며 제1패드부를 갖는 회로 기판; 상기 회로 기판 상에서 상기 발광소자 패키지를 덮는 레진층; 상기 레진층과 상기 회로 기판 사이에 배치되며, 상기 발광소자 패키지의 하부가 삽입된 반사부재; 및 상기 레진층 상에 상기 발광소자 패키지와 수직 방향으로 중첩된 차광부를 포함하며, 상기 제1리드 프레임은 상기 캐비티의 바닥에 배치된 제1프레임, 상기 제1프레임으로부터 상기 몸체의 하면으로 절곡되고 상기 회로 기판의 제1패드부와 접합되는 제1본딩부를 포함하며, 상기 제1본딩부는 상기 몸체의 하면에서 상기 몸체의 후면부를 향해 상기 몸체의 후면부보다 더 돌출될 수 있다.