LED LIGHTING DEVICE AND METHOD FOR MANUFACTURING SAME

• Main Authors: KEUM, Dong Ki, KIM, Byoungin, LEE, Jin
• Format: Patent
• Language: English; French; Korean
• Published: 24.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; SEMICONDUCTOR DEVICES; WEAPONS

A method for manufacturing an LED lighting device comprises the steps of: forming a separation layer on a substrate; patterning the separation layer; forming LEDs on the separation layer respectively; bonding a stretchable film to the upper surfaces of the LEDs and gap spaces between the LEDs; separating the separation layer from the substrate; stretching the stretchable film; exposing the upper surfaces of the LEDs; and forming electrodes on the upper surfaces of the LEDs and the lower surface of the separation layer or the lower surfaces of the LEDs. Un procédé de fabrication d'un dispositif d'éclairage à DEL comprend les étapes consistant à : former une couche de séparation sur un substrat ; configurer la couche de séparation ; former des DEL sur la couche de séparation respectivement ; lier un film étirable aux surfaces supérieures des DEL et à des espaces d'écartement entre les DEL ; séparer la couche de séparation du substrat ; étirer le film étirable ; exposer les surfaces supérieures des DEL ; et former des électrodes sur les surfaces supérieures des DEL et la surface inférieure de la couche de séparation ou les surfaces inférieures des DEL. LED 조명 장치의 제조 방법은 기판 상에 분리막을 형성하는 단계, 분리막을 패터닝하는 단계, 분리막 상에 LED를 각각 형성하는 단계, LED의 상면 및 이격 공간에 연신 필름을 결합하는 단계, 분리막을 기판에서 분리하는 단계, 연신 필름을 연신하는 단계, LED의 상면을 노출하는 단계, LED의 상면, 그리고 분리막의 하면 또는 LED의 하면에 전극을 형성하는 단계를 포함한다.