SUBSTRATE TEMPERATURE NON-UNIFORMITY REDUCTION OVER TARGET LIFE USING SPACING COMPENSATION
Methods and apparatus for processing a plurality of substrates are provided herein. In some embodiments, a method of processing a plurality of substrates in a physical vapor deposition (PVD) chamber includes: performing a series of reflow processes on a corresponding series of substrates over at lea...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French |
Published |
25.08.2022
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Subjects | |
Online Access | Get full text |
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