STRUCTURE AND MANUFACTURING METHOD OF STRUCTURE

This structure is provided with: a first substrate; a second substrate which is arranged opposite of the first substrate; and a bonding layer which, disposed between the first substrate and the second substrate, contains in the layer a first metal element with a -330 (kJ/mol of compounds) or higher...

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Bibliographic Details
Main Authors ABE, Shohei, UOMOTO, Miyuki, TAKAHASHI, Yuichi, SHIMATSU, Takehito
Format Patent
LanguageEnglish
French
Japanese
Published 18.08.2022
Subjects
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