STRUCTURE AND MANUFACTURING METHOD OF STRUCTURE
This structure is provided with: a first substrate; a second substrate which is arranged opposite of the first substrate; and a bonding layer which, disposed between the first substrate and the second substrate, contains in the layer a first metal element with a -330 (kJ/mol of compounds) or higher...
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Main Authors | , , , |
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Format | Patent |
Language | English French Japanese |
Published |
18.08.2022
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Subjects | |
Online Access | Get full text |
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