FILM-LIKE ADHESIVE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

• Main Authors: HOSHI Katsuaki, TOMISAKA Katsuhiko, KIKUCHI Kenta, OKOSHI Masashi, MATSUZAKI Toshiaki, IZAWA Hiroyuki, TAKAIRA Hiroshi, SATO Mayumi
• Format: Patent
• Language: English; French; Japanese
• Published: 28.07.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

Provided is a film-like adhesive 1 for connecting a circuit, the film-like adhesive 1 containing: solder particles 2 having a Bi content of 20-60 mass% and an Sn content of 40-80 mass%; a radically polymerizable compound; and a thermal radical-generating agent, wherein the average particle diameter...