WAFER EDGE CLEANING METHOD AND CLEANING DEVICE

Provided in embodiments of the present application are a wafer edge cleaning method and a wafer edge cleaning device. The cleaning method comprises: providing a wafer, which has a wafer edge; and controlling the wafer to be in a rotation stage so as to rotate the wafer, and providing a cleaning solu...

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Bibliographic Details
Main Authors MEI, Xiaobo, LIU, Haodong
Format Patent
LanguageChinese
English
French
Published 28.07.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided in embodiments of the present application are a wafer edge cleaning method and a wafer edge cleaning device. The cleaning method comprises: providing a wafer, which has a wafer edge; and controlling the wafer to be in a rotation stage so as to rotate the wafer, and providing a cleaning solution for the wafer edge in the rotation stage, wherein the rotation stage comprises a first rotation stage and/or a second rotation stage, the rotation speed of the wafer is gradually increased from a first rotation speed to a second rotation speed in the process of the first rotation stage, and the rotation speed of the wafer is gradually decreased from the second rotation speed to the first rotation speed in the process of the second rotating stage, the second rotation speed being greater than the first rotation speed. The wafer edge cleaning method provided in the embodiments of the present application is beneficial to improving the cleaning effect of a wafer edge. Des modes de réalisation de la présente inventi
Bibliography:Application Number: WO2021CN107895