CHIP EMBEDDED COMPOSITE FOR ELECTRON BEAM EXPOSURE, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF

• Main Authors: LIU, Gexing, ZHANG, Zhaoyu, LI, Haochuan, HUANG, Yaoran
• Format: Patent
• Language: Chinese; English; French
• Published: 21.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A preparation method for a chip embedded composite for electron beam exposure. The preparation method comprises: providing a composite structure, wherein the composite structure comprises a first substrate (1), a conductive layer (2) provided on the surface of the first substrate (1), and a chip array (3) provided on the surface of the conductive layer (2) away from the first substrate (1); laying a protective layer (4) on the outer surface of the chip array (3), the protective layer (4) covering the chip array (3); performing packaging and curing processing on the composite structure and the protective layer (4) by using a polymer solution; and removing the protective layer (4) to obtain the chip embedded composite. The method relates to the field of semiconductor chip manufacturing; the photoetching area of a chip can be fully utilized, and a small chip is used for spinning glue; and the method has characteristics such as low material cost, convenient operation, short operation time, and bottom surface cond