WAFER WITH BURIED V-GROOVE CAVITY FOR FIBER COUPLING

• Main Authors: IKONEN, Janne, LEROSE, Damiana, NYKÄNEN, Henri, DRAKE, John Paul
• Format: Patent
• Language: English; French
• Published: 16.06.2022

A wafer with a buried V-groove cavity, and a method for fabricating V-grooves. In some embodiments, the method includes bonding a first layer, to a top surface of a substrate, to form a composite wafer, the first layer being composed of a first semiconductor material, the substrate being composed of...