PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT PATTERN, AND METHOD FOR PRODUCING WIRING BOARD

• Main Authors: KUME Masakazu, IWASHITA Kenichi, KATO Tetsuya, KUROSAWA Tsuyoshi, NARITA Mao, KAGUCHI Yosuke
• Format: Patent
• Language: English; French; Japanese
• Published: 19.05.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

A photosensitive element 1 which is provided with a support film 10 and a photosensitive layer 20 that is arranged on the support film 10, wherein: the number of defects within the support film 10, said defects having a maximum diameter of 1 μm or more, is 100 or less per 0.225 mm2; and the photosensitive layer 20 contains a binder polymer, a photopolymerizable compound that has an ethylenically unsaturated bond, and a photopolymerization initiator. La présente invention concerne un élément photosensible 1 qui est pourvu d'un film de support 10 et d'une couche photosensible 20 qui est disposée sur le film de support 10. Le nombre de défauts à l'intérieur du film de support 10, lesdits défauts ayant un diamètre maximal de 1 µm ou plus, est de 100 ou moins par 0,225 mm2, et la couche photosensible 20 contient un polymère liant, un composé photopolymérisable qui a une liaison éthyléniquement insaturée, et un initiateur de photopolymérisation. 支持フィルム１０と、支持フィルム１０上に配置された感光層２０と、を備え、支持フィルム１０の内部における最大径１μｍ以上の欠陥の数が０．２２５ｍｍ２あたり１００個以下であり、感光層２０が、バインダーポリマーと、エチレン性不飽和結合を有する光重合性化合物と、光重合開始剤と、を含有する、感光性エレメント１。