MANUFACTURING METHOD FOR COMPLEX AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

• Main Authors: MATSUBAYASHI, Ryo, UMEDA, Hidekazu, KONDA, Tetsushi, KITAMURA, Kenji, HAGIWARA, Takahito
• Format: Patent
• Language: English; French; Japanese
• Published: 19.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The purpose of the present disclosure is to provide a manufacturing method for a complex, which can increase the efficiency of producing a joining layer while suppressing the occurrence of a void in the joining layer in the manufacturing of a complex including a base material, the joining layer, and...