PACKAGING METHOD FOR SEMICONDUCTOR STRUCTURE, PACKAGING STRUCTURE, AND CHIP

• Main Authors: XIE, Ling, YANG, Yan, SUN, Fujun, ZHANG, Peng, TANG, Bo, WANG, Wenwu, LIU, Ruonan, LI, Bin, LI, Zhihua, HUANG, Kai
• Format: Patent
• Language: Chinese; English; French
• Published: 07.04.2022
• Subjects: OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS

A packaging method for a semiconductor structure, a packaging structure, and a chip. The packaging method for a semiconductor structure comprises: forming a semiconductor structure on an SOI wafer; depositing, by means of plasma-enhanced chemical vapor deposition (PECVD), silicon oxide on the surface of the semiconductor structure provided with a trench opening; and performing a subsequent packaging process. By sealing a trench opening of a semiconductor structure by using the characteristic of low step coverage of PECVD, the problem of device failures caused by trench blocking due to subsequent filling of a packaging material is solved. La présente invention concerne un procédé d'encapsulation pour une structure semi-conductrice, une structure d'encapsulation et une puce. Le procédé d'encapsulation pour une structure semi-conductrice comprend : la formation d'une structure semi-conductrice sur une tranche SOI ; le dépôt, au moyen d'un dépôt chimique en phase vapeur assisté par plasma (PECVD), de l'oxyde de s