HIGH-POWER POWER AMPLIFICATION MODULE AND METHOD FOR ASSEMBLING HIGH-POWER POWER AMPLIFICATION MODULE

A high-power power amplification module, a remote radio unit, and a method for assembling the high-power power amplification module. The high-power power amplification module comprises a circuit board (101) and an isolator assembly (10), the isolator assembly (10) comprises an isolator (11) and a br...

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Bibliographic Details
Main Authors LI, Huahong, GONG, Changrong, GONG, Liping
Format Patent
LanguageChinese
English
French
Published 31.03.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A high-power power amplification module, a remote radio unit, and a method for assembling the high-power power amplification module. The high-power power amplification module comprises a circuit board (101) and an isolator assembly (10), the isolator assembly (10) comprises an isolator (11) and a bracket assembly (12), and the isolator (11) is fixed to the circuit board (101) by means of the bracket assembly (12). L'invention concerne un module d'amplification de puissance haute puissance, une unité radio distante et un procédé d'assemblage du module d'amplification de puissance haute puissance. Le module d'amplification de puissance haute puissance comprend une carte de circuit imprimé (101) et un ensemble isolateur (10), l'ensemble isolateur (10) comprenant un isolateur (11) et un ensemble support (12), et l'isolateur (11) étant fixé à la carte de circuit imprimé (101) au moyen de l'ensemble support (12). 一种大功率功放模块、射频拉远单元及大功率功放模块装配方法，所述大功率功放模块包括电路板(101)以及隔离器组件(10)，所述隔离器组件(10)包括隔离器(11)以及支架组件(12)，所述隔离器(11)通过所
Bibliography:Application Number: WO2021CN91265