METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES

• Main Authors: MITSUKURA Kazuyuki, FUJITA Hiroaki, OTAKE Shunsuke, SHIMAOKA Shinji, TAKAHASHI Masaki
• Format: Patent
• Language: English; French; Japanese
• Published: 24.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention discloses a method for producing a substrate material for semiconductor packages, said method comprising a step wherein the temperature of a multilayer body, which comprises a metal foil, one or more sheets of a prepreg, and another metal foil sequentially stacked in this order...