LOW DIELECTRIC COMPOSITE FILM FOR COPPER CLAD LAMINATE (CCL), AND LOW DIELECTRIC COPPER CLAD LAMINTE (CCL) COMPRISING SAME

• Main Authors: JEONG, Ji Hong, CHO, Woo Hyun, KIM, Du Yeong, KIM, Won Soo
• Format: Patent
• Language: English; French; Korean
• Published: 17.03.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

The present invention relates to a low dielectric composite film for a copper clad laminate (CCL), and more specifically to a low dielectric composite film for a copper clad laminate (CCL) and a low dielectric copper clad laminate comprising same, having the benefits of having significantly low dielectric permittivity and dielectric loss, and having a significantly low coefficient of expansion whilst also having excellent mechanical properties. La présente invention concerne un film composite faiblement diélectrique destiné à un stratifié cuivré (CCL), et plus précisément un film composite faiblement diélectrique destiné à un stratifié cuivré (CCL) et un stratifié cuivré faiblement diélectrique le comprenant, ayant pour avantages de présenter une permittivité diélectrique et une perte diélectrique extrêmement faibles, et ayant un coefficient de dilatation extrêmement faible tout en présentant également d'excellentes propriétés mécaniques. 본 발명은 동박적층판(CCL)용 저유전 복합필름에 관한 것으로, 더욱 상세하게는 유전율과 유전손실이 현격히 낮고, 기계적 물성이 우수한 동시에 열팽창계수가 현격히 낮은 효과를 발현하는 동박적층판(CCL)용 저유전 복합필름 및 이를 포함하는 저유전 동박적층판에 관한 것이다.