HEAT DISSIPATION SHEET AND ELECTRONIC DEVICE COMPRISING SAME

The present invention provides a heat dissipation sheet and an electronic device comprising same, the sheet being capable of promoting excellent heat dissipation performance and improvement in thermal conductivity while preventing the scattering of graphite chips generated from a graphite sheet, and...

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Bibliographic Details
Main Authors LEE, Kwang Joo, PARK, Tae Jeong
Format Patent
LanguageEnglish
French
Korean
Published 10.02.2022
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Summary:The present invention provides a heat dissipation sheet and an electronic device comprising same, the sheet being capable of promoting excellent heat dissipation performance and improvement in thermal conductivity while preventing the scattering of graphite chips generated from a graphite sheet, and being effectively applicable and usable in an electronic device with a small bezel thickness. The heat dissipation sheet according to the present design comprises a graphite sheet and upper and lower films attached, respectively, to the upper and lower surfaces of the graphite sheet, wherein a sealing member is filled in the exterior portion of the graphite sheet positioned between the upper and lower films. La présente invention concerne une feuille de dissipation de chaleur et un dispositif électronique la comprenant, la feuille permettant de favoriser d'excellentes performances de dissipation de chaleur et une amélioration de la conductivité thermique tout en empêchant la diffusion de puces de graphite générées à partir d'une feuille de graphite, étant applicable de manière efficace et utilisable dans un dispositif électronique ayant une petite épaisseur de cadre frontal. La feuille de dissipation de chaleur selon la présente invention comprend une feuille de graphite et des films supérieur et inférieur fixés, respectivement, aux surfaces supérieure et inférieure de la feuille de graphite, un élément d'étanchéité étant rempli dans la partie extérieure de la feuille de graphite positionnée entre les films supérieur et inférieur. 본 고안은 흑연시트로부터 발생되는 흑연 칩의 비산을 방지하면서 우수한 방열성능 및 열전도도 향상을 도모할 수 있고, 베젤(bezel) 두께가 얇은 전자기기에도 효과적으로 적용하여 사용할 수 있는 방열시트 및 이를 구비하는 전자기기를 제공한다. 본 고안에 따른 방열시트는, 흑연시트와; 흑연시트의 상,하면에 각각 부착되는 상,하부 필름;을 포함하며, 상기 상,하부 필름 사이에 위치한 상기 흑연시트의 외곽 부분에는 실링부재가 충진된 것을 특징으로 한다.
Bibliography:Application Number: WO2021KR09680