ELECTRICALLY CONDUCTIVE PASTE, PRINTED WIRING BOARD, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

• Main Authors: TAJIMA, Izumi, MIZUGUCHI, Tsukuru, ITSUKI, Naohide
• Format: Patent
• Language: English; French; Japanese
• Published: 10.02.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES

The purpose of the present invention is to provide electrically conductive paste which makes it possible to increase the strength of bonding to an electronic component without using a separate adhesive agent. Provided is electrically conductive paste containing an organic component and electrically conductive particles, wherein a dry film of the electrically conductive paste has a storage modulus G' at 100°C (P100) of 0.01 MPa or less, and has a storage modulus G' at 25°C (C25) of 0.01 MPa or more after heating at 140°C for 30 minutes. Le but de la présente invention est de fournir une pâte électroconductrice qui permet d'augmenter la force de liaison à un composant électronique sans utiliser un agent adhésif distinct. L'invention concerne une pâte électroconductrice contenant un composant organique et des particules électroconductrices, un film sec de la pâte électroconductrice ayant un module de conservation G' à 100 °C (P100) de 0,01 MPa ou moins et ayant un module de conservation G' à 25 °C (C25) de 0,01 MPa ou plus après avoir été chauffé à 140 °C pendant 30 minutes. 本発明は、別途接着剤を用いずとも、電子部品との接合強度を高めることができる導電ペーストを提供することを目的とする。有機成分および導電性粒子を含有する導電ペーストであって、前記導電ペーストの乾燥膜の１００℃における貯蔵弾性率Ｇ'（Ｐ１００）が０．０１ＭＰａ以下であり、１４０℃で３０分間加熱した後の２５℃における貯蔵弾性率Ｇ'（Ｃ２５）が０．０１ＭＰａ以上である導電ペーストである。