ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE CONTROL

Embodiments of the disclosure provide electrostatic chucks for securing substrates during processing. Some embodiments of this disclosure provide methods and apparatus for increased temperature control across the radial profile of the substrate. Some embodiments of the disclosure provide methods and...

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Bibliographic Details
Main Authors SEUTTER, Sean M, BOYD, Wendell Glenn, ATHANI, Shekhar, PINSON, Jay Dee, PANAVALAPPIL KUMARANKUTTY, Hanish Kumar, KALAL, Anil Kumar, RAMAMURTHI, Badri, GONDHALEKAR, Sudhir R
Format Patent
LanguageEnglish
French
Published 13.01.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments of the disclosure provide electrostatic chucks for securing substrates during processing. Some embodiments of this disclosure provide methods and apparatus for increased temperature control across the radial profile of the substrate. Some embodiments of the disclosure provide methods and apparatus for providing control of hydrogen concentration in processed films during a high-density plasma (HDP) process. Des modes de réalisation de la divulgation concernent des mandrins électrostatiques servant à fixer des substrats au cours d'un traitement. Certains modes de réalisation de cette divulgation concernent des procédés et un appareil permettant une régulation thermique accrue à travers le profil radial du substrat. Certains modes de réalisation de la divulgation concernent des procédés et un appareil permettant de réguler la concentration d'hydrogène dans des films traités au cours d'un processus à plasma haute densité (HDP).
Bibliography:Application Number: WO2021US40476