PRESSED SILICON CARBIDE CERAMIC (SIC) FLUIDIC MODULES WITH INTEGRATED HEAT EXCHANGE

A silicon carbide flow reactor fluidic module comprises a monolithic closed-porosity silicon carbide body, a tortuous fluid passage extending through the silicon carbide body, the tortuous fluid passage having an interior surface, and one or more thermal control fluid passages also extending through...

Full description

Saved in:
Bibliographic Details
Main Authors CUNO, Alexander Lee, SUTHERLAND, James Scott, LIM, Howen
Format Patent
LanguageEnglish
French
Published 06.01.2022
Subjects
ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
LIME, MAGNESIA
METALLURGY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
REFRACTORIES
SLAG
THEIR RELEVANT APPARATUS
TRANSPORTING
TREATMENT OF NATURAL STONE
Online AccessGet full text

Cover

More Information
Summary:A silicon carbide flow reactor fluidic module comprises a monolithic closed-porosity silicon carbide body, a tortuous fluid passage extending through the silicon carbide body, the tortuous fluid passage having an interior surface, and one or more thermal control fluid passages also extending through the silicon carbide body, the interior surface having a surface roughness of less than 10 µm Ra. A process for forming such modules is also disclosed. La présente invention concerne un module fluidique de réacteur en écoulement de carbure de silicium qui comprend un corps monolithique en carbure de silicium à porosité fermée, un passage fluidique sinueux s'étendant à travers le corps en carbure de silicium, le passage fluidique sinueux ayant une surface intérieure, et un ou plusieurs passages fluidiques de régulation thermique s'étendant également à travers le corps en carbure de silicium, la surface intérieure ayant une rugosité de surface inférieure à 10 µm Ra. L'invention concerne également un procédé de formation de tels modules.
Bibliography:Application Number: WO2021US38841