FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UB...

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Bibliographic Details
Main Authors ZHAO, Lily, SUN, Yangyang, HE, Dongming
Format Patent
LanguageEnglish
French
Published 06.01.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UBMs having a second size and a second minimum pitch. The first set of UBMs and the second set of UBMs are each electrically coupled to the package substrate by a bond-on-pad connection. Un dispositif à puce retournée est divulgué. Le dispositif à puce retournée comprend une matrice ayant une pluralité de métallisations sous bosse (UBM) ; et un substrat de paquet ayant une pluralité de plots de connexion. La pluralité d'UBM comprend un premier ensemble d'UBM ayant une première taille et un premier pas minimal et un second ensemble d'UBM ayant une seconde taille et un second pas minimal. Le premier ensemble d'UBM et le second ensemble d'UBM sont chacun électriquement couplés au substrat de paquet par une liaison de connexion sur plot.
Bibliography:Application Number: WO2021US34862