MANUFACTURING METHOD OF A RADIO-FREQUENCY SMART CARD WITH A METAL INLAY ASSEMBLY
The invention relates to a manufacturing method of a radio-frequency (1A, 1B) smart card with a metal inlay (4), said method including the following steps: - forming a card body (1A, 1B, 11) including said metal inlay (4) in the form of a metal plate (4i) equipped with a cavity (22), - arranging at...
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Main Authors | , , , |
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Format | Patent |
Language | English French |
Published |
16.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a manufacturing method of a radio-frequency (1A, 1B) smart card with a metal inlay (4), said method including the following steps: - forming a card body (1A, 1B, 11) including said metal inlay (4) in the form of a metal plate (4i) equipped with a cavity (22), - arranging at least a radiofrequency transponder (5c) antenna inside this cavity (22); The method is characterized in that it comprises a step of arranging an external metal element (4e) around said metal plate (4i) for forming the metal inlay (4), said external metal element being visible on the edge (14) of the card (11).
L'invention concerne un procédé de fabrication d'une carte à puce radiofréquence (1A, 1B) dotée d'une incrustation métallique (4), ledit procédé comprenant les étapes suivantes : - formation d'un corps de carte (1A, 1B, 11) comprenant ladite incrustation métallique (4) sous la forme d'une plaque métallique (4i) équipée d'une cavité (22), - disposition d'au moins une antenne de transpondeur radiofréquence (5c) à l'intérieur de cette cavité (22); le procédé étant caractérisé en ce qu'il comprend une étape de disposition d'un élément métallique externe (4e) autour de ladite plaque métallique (4i) pour former l'incrustation métallique (4), ledit élément métallique externe étant visible sur la tranche (14) de la carte (11). |
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Bibliography: | Application Number: WO2021EP65467 |