INTEGRATED SENSORS

An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds. L'invention concerne un appareil. L'appareil peut comprendre un sub...

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Bibliographic Details
Main Authors JELKIN, Duane M, OLSEN, Clark T
Format Patent
LanguageEnglish
French
Published 18.11.2021
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds. L'invention concerne un appareil. L'appareil peut comprendre un substrat et un ou plusieurs capteurs montés sur le substrat. Le ou les capteurs peuvent être montés sur le substrat à l'aide d'un matériau adhésif et d'une ou plusieurs soudures par points.
Bibliography:Application Number: WO2021US31730